ETEB

启明光大
启明光大
启明光大
启明光大
启明光大
>
>
>
The 2017 International Printed Electronics and Smart Packaging Industry Development Summit Forum was held in Changzhou and achieved complete success

ABOUT US

The 2017 International Printed Electronics and Smart Packaging Industry Development Summit Forum was held in Changzhou and achieved complete success

  • Time of issue:2017-11-02 16:10
  • Views:

(Summary description)On October 24, 2017, the 2017 International Printed Electronics and Smart Packaging Industry Development Summit Forum was held in Changzhou High-tech Zone and achieved a complete success. The conference was hosted by Changzhou Institute of Printed Electronics Industry

The 2017 International Printed Electronics and Smart Packaging Industry Development Summit Forum was held in Changzhou and achieved complete success

(Summary description)On October 24, 2017, the 2017 International Printed Electronics and Smart Packaging Industry Development Summit Forum was held in Changzhou High-tech Zone and achieved a complete success. The conference was hosted by Changzhou Institute of Printed Electronics Industry

  • Categories:Company news
  • Author:
  • Origin:
  • Time of issue:2017-11-02 16:10
  • Views:
Information

On October 24, 2017, the 2017 International Printed Electronics and Smart Packaging Industry Development Summit Forum was held in Changzhou High-tech Zone and achieved a complete success. The conference was hosted by Changzhou Institute of Printed Electronics Industry, National Printed Electronics Industry Technology Innovation Alliance, Printed Electronics and Intelligent Packaging Industry Consortium, and hosted by Changzhou Enfusai Printing Electronics Co., Ltd. and Ruitong Technology Media. A total of more than 300 representatives from domestic and foreign printed electronics and smart packaging related industry organizations, print electronics smart packaging industry consortium preparation units, smart packaging and printing industry end users, industry-university-research, investment and financing institutions, etc., attended the summit.

1

(meeting venue)

The summit focused on the application of global printed electronics technology in the smart packaging industry, market status, development trends, opportunities and challenges faced, and other topics. At the same time as the summit, preparations for the establishment of the world's first "printed electronic smart packaging industry consortium" , And issue a consortium certification membership certificate, and join the consortium members to jointly promote the development of China's smart packaging industrialization.

1

Group photo of all members of the consortium

(Dr. Zhang Xiachang, Dean of Changzhou Institute of Printed Electronics, and Zhu Yanping, Vice Dean of Changzhou Institute of Printed Electronics, issued certificates to members of the consortium)

 

In the morning, Zhang Xiachang, president of the Changzhou Institute of Printed Electronics Industry, expert of the National Thousand Talents Program, and inventor of thin-film printed batteries, gave a keynote speech titled "Development Status of China's Printed Electronics Industry and Progress in Preparations for Consortium" and hosted the joint ID TechEx Senior Technical Analyst Dr. Xiaoxi He introduced the "Past Review and Future Trends of Smart Packaging"; Dr. Klaus Hecker, Managing Director of OE-A, introduced the "Roadmap of Organic and Printed Electronics Technology: Smart Packaging Applications" Opportunities and challenges of

1

(At the top is Dr. Xiachang Zhang, Dean of Changzhou Institute of Printed Electronics Industry, at the bottom left is Dr. He Xiaoxi, a senior technical analyst at ID TechEx, and at the bottom right is Dr. Klaus Hecker, Managing Director of OE-A)

 

In the afternoon "Application of Electronic Anti-counterfeiting Technology and Special Materials in the Field of Smart Packaging", Dr. Chen Guangxue, chief technical expert of Yutong Technology and Dean of Yutong Research Institute, introduced the "Application of Digital and Visualization Technology in Smart Packaging" ;Professor Cao Congjun, Executive Deputy Dean of School of Printing, Packaging and Digital Media, Xi’an University of Technology and Director of Shaanxi Printing and Packaging Engineering Technology Research Center, introduced "Smart Label Technology Development and Industrial Application"; Professor Gyoujin Cho of Sunchon National University in South Korea introduced " Bridging R2R gravure printed FPCB and Si-chip to demonstrate a temperature sensor integrated NFC tag for food packaging"; Dr. Ye Changqing, general manager of Suzhou Zhongkenafu Material Technology Co., Ltd., introduced the "color sensor integrated NFC tag for food packaging"; Zhibao smart label, relay cold chain "last mile"; Professor Wang Jun of the Department of Packaging Engineering of Jiangnan University introduced "Smart packaging to enhance consumer experience-from case to practice"; Zhang Xingye, associate researcher of the Institute of Chemistry, Chinese Academy of Sciences introduced "Nano conductive ink and its application in the field of smart packaging".

1

(Guest speaker at the consortium)

 

In the afternoon "Application of RFID and Internet of Things Technology in the Field of Intelligent Packaging" sub-session, hosted by Dr. Zhang Jie, Vice President of Changzhou Institute of Printed Electronics Industry, Zhang Kaixing, Chairman of Shenzhen Kaigeli Intelligent Technology Co., Ltd. introduced Core packaging, smart forward-the application of RFID technology in the field of intelligent packaging"; Dr. Toshihide KAMATA of AIST, Director of Flexible Electronics Research Center introduced "Advanced print manufacturing techniques for intelligent packaging" (Advanced print manufacturing techniques for intelligent packaging) Technology); Professor Guo Xiaojun of Shanghai Jiaotong University introduced "Low-power flexible hybrid integrated electronic system: traceability, anti-counterfeiting and perception"; Tommy Hoglund of RISE Acreo introduced "How to integrate printed hybrid electronics in packaging and other smart label solutions" ( How to integrate printing hybrid electronics into packaging and other smart label solutions) Dr. Jiang Hua, Vice President of Jinjia Group, introduced "Application of Internet of Things Technology in the Field of Smart Packaging"; Director of Planning and Development Department of TOPPAN Toppan Security and Anti-counterfeiting Business Promotion Department Zhong Lin Guiguang introduced "NFC application solutions and case practices in smart packaging".

1

(Guangdong Nanhai Qiming Everbright Technology Co., Ltd.)

 

The summit conducted in-depth communication and discussion on topics such as the development and prospects of the smart packaging industry, and gathered upstream and downstream companies such as well-known domestic smart packaging suppliers, solution providers, and spare parts suppliers, and proposed the development of the domestic smart packaging industry. Many constructive comments and suggestions. At the same time, the formation of a "printed electronics and smart packaging industry consortium" as the core, integrating the smart packaging industry chain and opening up the closed loop of the industry is of great significance to the development of the smart packaging industry and is a milestone moment for the development of my country's smart packaging industry.

The "2017 International Printed Electronics and Intelligent Packaging Industry Development Summit Forum" was successfully concluded with a speech by Mr. Wang Zhan, Vice President of Enforsa Printed Electronics. The guests at the conference gave a warm applause, and the summit ended successfully.

 

Scan the QR code to read on your phone

key words: Conductive ink  Printed electronics  Nano silver  Nano silver particles  Transparent conductive film  Silver nano sheet

 ETEB
 ETEB

Contact us

Email:jason.gao@eteb.com.cn
Guangdong Nanhai ETEB Technology Co.,LTD
Address:NO.5 Nan'gang Street,Pingzhou,Guicheng,Nanhai District,Foshan City,Guangdong Province,China

粤ICP备14075474号-1   Technical Support : 300.cn foshan